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Heicard QPE & TMSI OTA ICCID Simhub Sim Card Support Update for iPhone 6 to 14Pro Max $2.70
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MIPI NB-PRO MIPI TESTER BOX $450.00

WL HT007 Intelligent Pre-Heating Platform Motherboard Middle Frame Layered Separater For iPhone X-13 mini/14 Pro max Soldering Station

$294.00

10 in stock

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SKU: WL-HT007 Categories: ,
Description

FUNCTION:

For iPhone Motherboardheating layered module,design only heats the center column and does not hurt other ICs.Support motherboard layering, tin planting, bonding, edge glue removal.


SUPPORT MODEL:

X-XS-XS Max

X-11Pro Max

11-11Pro-11Pro Max

13mini-13Pro

12mini-12Pro Max 

13-13Pro Max

Additional information
Weight 1.2 kg
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