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“JC IPhone 8 8Plus Intel Baseband / Qualcomm Baseband / Logic EEPROM IC Reading / Re-Writing Module (No Need Remove IC) Compatible With JC PRO1000S” has been added to your cart. View cart
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Home REPAIR TOOLS Hand Tools B&R C-04 3in1 Chip Dismantle BGA CPU Scraper Shovel Glue Pry Knife
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B&R C-04 3in1 Chip Dismantle BGA CPU Scraper Shovel Glue Pry Knife

$4.00

98 in stock

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SKU: B&R C-04 3in1 Chip Dismantle BGA CPU Categories: Hand Tools, NEW ARRIVALS Tag: B&R C-04 3in1 Chip Dismantle BGA CPU Scraper Shovel Glue Pry Knife
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Description

B&R 3in1 Chip Dismantle BGA CPU Scraper Shovel Glue Pry Knife, Professional repair toolset for mobile phone CPU disassemble, It can be used to separate the welding spot, Good for BGA repair, dismantling phone IC chip. 

Specification:
Material: Alloy steel, Metal  
Handle length: 135 mm 


Package includes:
1 x Handle
3 x Blades

Additional information
Weight 0.12 kg
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