QIANLI IP X STENCIL
QIANLI IP X STENCIL
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QIANLI IP X STENCIL
QIANLI IP X STENCIL
WU-XIN-JI-Mobile-phone-repair-platform
WU XIN JI Phone Repair Schematics Dongle Original price was: $99.00.Current price is: $69.99.
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0.10MM CUTTING WIRE 100METER
0.10MM CUTTING WIRE 100METER $2.00

IPhone X Positioning Mold Steel Plate IPhone X BGA Reballing Stencils

$3.90

100 in stock

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SKU: IPhone X Positioning Mold Steel Plate Category: Tag:
Description

IPhone X Positioning Mold Steel Plate IPhone X BGA Reballing Stencils

BGA Reballing Stencil Template for repair iPhone X motherboard, iPhone X Positioning Mold steel plate, iPhone X Fixed Frame steel plate for BGA Reballing Stencil, iPhone PCB board Positioning Mold steel plate.

Additional information
Weight 0.09 kg
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