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“T12-11 75W 220V Lead-Free Soldering Station Digital Welding Station For Phone IPad Table PCB Mainboard Repair” has been added to your cart. View cart
MIJING 3D STENCIL
MIJING 3D STENCIL
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MIJING 3D STENCIL
MIJING 3D STENCIL
Home CATEGORIES MJ 3D BGA Reballing Stencil Template Groove For IPhone A8 A9 A10 A11
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STENCIL 5 5C5S
WL BGA Reballing Stencil Template Iphone 5/5C/5S BGA Rework Stencils $10.00

MJ 3D BGA Reballing Stencil Template Groove For IPhone A8 A9 A10 A11

$12.90

100 in stock

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SKU: MJ 3D BGA Reballing Stencil Template Category: CATEGORIES Tag: MJ 3D BGA Reballing Stencil Template Groove For IPhone A8 A9 A10 A11
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Description

New Style 3D BGA planting Stencil: Stepped groove /  easy to use / Accuratea Lignment

1.Stepped groove design enables stencil to align with tinning position of IC rapidly.
2.The square holes design makes it easier to take out the formed solder balls.
3.This 3D stencil is easy to use no matter you are a new or expert.
4.High success rate of planting tin,the solder balls can be formed once after you are proficient.
5.This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer.

Option 1:  MJ 3D A8 For iphone 6 6P
Option 2:  MJ 3D A9 For iphone 6S 6SP
Option 3:  MJ 3D A10 For iphone 7 7P
Option 4:  MJ 3D A11 For iphone 8 8P X

Additional information
Weight 0.1 kg
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