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Home REPAIR TOOLS Original Mijing Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle For Quick 861DW 2008 Hot Air Soldering Station For Repair IPhone X Motherboard Mainboard
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WL BGA Reballing Stencil Template Iphone 5/5C/5S BGA Rework Stencils $10.00

Original Mijing Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle For Quick 861DW 2008 Hot Air Soldering Station For Repair IPhone X Motherboard Mainboard

$10.00

100 in stock

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SKU: Original Mijing Special Design Hot Air Gun Category: REPAIR TOOLS Tag: Original Mijing Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle For Quick 861DW 2008 Hot Air Soldering Station For Repair IPhone X Motherboard Mainboard
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Description

Original Mijing Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle For Quick 861DW 2008 Hot Air Soldering Station For Repair IPhone X Motherboard Mainboard

Original Mijing Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle for Quick 861DW 2008 Hot Air Soldering Station for Repair iPhone X Motherboard Mainboard (Mainboard not include)

  • Dedicated for iPhone X motherboard, special design, easy and quick disassembly of double-layer motherboard
  • Protect the NAND/PCIE, CPU, WIFI, baseband, does not cause imaginary welding
  • Compatible only for Quick 861DW or Quick2008. Click here to buy Quick 861DW or Quick2008

Additional information
Weight 0.01 kg
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